The project titled “Thermal Analysis Simulation of Semiconductor Packages using Thermal Interface Materials enhanced with Boron Nitride Nanotube (BNNT)” aims to address the challenge of heat management in modern semiconductor devices with high power densities. This project will focus on modeling the thermal performance of semiconductor packages using TIMs enhanced with boron nitride nanotubes (BNNTs). The modeling is intended to provide valuable insights into potential improvements in heat dissipation and overall thermal management efficiency.

The main objectives of the project include:

• Developing a simulation model for thermal analysis of semiconductor packages.
• Evaluating the thermal conductivity and thermal resistance of BNNT-enhanced TIMs through simulation.
• Comparing the thermal performance of BNNT-enhanced TIMs with conventional TIMs in the simulation environment.
• Predicting the impact of BNNT-enhanced TIMs on thermal management of semiconductor packages.